Case for electronic device

Sogabe March 19, 2

Patent Grant D677888

U.S. patent number D677,888 [Application Number D/371,841] was granted by the patent office on 2013-03-19 for case for electronic device. This patent grant is currently assigned to Sony Computer Entertainment Inc.. The grantee listed for this patent is Takashi Sogabe. Invention is credited to Takashi Sogabe.


United States Patent D677,888
Sogabe March 19, 2013

Case for electronic device

Claims

CLAIM The ornamental design for a case for an electronic device, as shown.
Inventors: Sogabe; Takashi (Tokyo, JP)
Applicant:
Name City State Country Type

Sogabe; Takashi

Tokyo

N/A

JP
Assignee: Sony Computer Entertainment Inc. (Tokyo, JP)
Appl. No.: D/371,841
Filed: October 21, 2011

Foreign Application Priority Data

Jun 3, 2011 [JP] D2011-012691
Current U.S. Class: D3/269
Current International Class: 0301
Field of Search: ;D3/269,218,219,275,294-295,901,903 ;D6/407,632,633,634 ;D14/356,341,345 ;D28/78,83 ;206/37,307,315.1,320

References Cited [Referenced By]

U.S. Patent Documents
D461631 August 2002 Hussaini et al.
D542032 May 2007 Williams et al.
7387209 June 2008 Ko et al.
D635354 April 2011 Uchida
D668045 October 2012 Robbins et al.
Foreign Patent Documents
30-0416876 Jun 2006 KR

Other References

"HTT Leather Case for PSP," PDA Kobo, 3 sheets, http://www.pdakobo.com/review/case/psp/htt-psp.htm (2005). cited by applicant .
"PDair Leather Case for PSP," Miyavix Co. Ltd., 3 sheets http://www.miyavix.co.jp/product/pdair/psp.sub.--lathercase/index.html (Jan. 2005). cited by applicant .
"Zenus for PSP2000," Rakuten Co., 5 sheets, http://item.rakuten.co.jp/whoisshop/zenus.sub.--psp.sub.--case/ (2009). cited by applicant .
"Leather Armor for PSP," XIGMAStyle Japan Co., Ltd., 3 sheets, http:xigma.jp/05/psp/armor/main.html (2005). cited by applicant .
Decision to Grant in Taiwanese Application No. 100305853, dated Jun. 22, 2012. cited by applicant.

Primary Examiner: Ramirez; Cynthia
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a perspective view of a case for an electronic device showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

* * * * *

References


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