U.S. patent number D669,453 [Application Number D/371,996] was granted by the patent office on 2012-10-23 for earphone.
This patent grant is currently assigned to Sony Corporation. Invention is credited to Junko Katsuraku, Takumi Suzuki.
United States Patent |
D669,453 |
Katsuraku , et al. |
October 23, 2012 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and
described.
Inventors: |
Katsuraku; Junko (Tokyo,
JP), Suzuki; Takumi (Tokyo, JP) |
Assignee: |
Sony Corporation (Tokyo,
JP)
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Appl.
No.: |
D/371,996 |
Filed: |
April 12, 2012 |
Foreign Application Priority Data
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Nov 30, 2010 [JP] |
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D2010-028616 |
Nov 30, 2010 [JP] |
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D2010-028617 |
Nov 30, 2010 [JP] |
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D2010-028632 |
Nov 30, 2010 [JP] |
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D2010-028633 |
Nov 30, 2010 [JP] |
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D2010-028634 |
Nov 30, 2010 [JP] |
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D2010-028635 |
Nov 30, 2010 [JP] |
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D2010-028636 |
Nov 30, 2010 [JP] |
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D2010-028637 |
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Current U.S.
Class: |
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206,223
;181/129,130,135 ;379/430,431 ;381/380,381,322,328 ;473/569,570
;273/108 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a perspective view of a first embodiment of an earphone
showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof; and
FIG. 6 is a bottom plan view thereof.
FIG. 7 is a perspective view of a second embodiment of an earphone
showing our new design;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a left side elevational view thereof;
FIG. 10 is a right side elevational view thereof;
FIG. 11 is a top plan view thereof; and
FIG. 12 is a bottom plan view thereof.
FIG. 13 is a perspective view of a third embodiment of an earphone
showing our new design;
FIG. 14 is a front elevational view thereof;
FIG. 15 is a left side elevational view thereof;
FIG. 16 is a right side elevational view thereof;
FIG. 17 is a top plan view thereof; and
FIG. 18 is a bottom plan view thereof.
FIG. 19 is a perspective view of a fourth embodiment of an earphone
showing our new design;
FIG. 20 is a front elevational view thereof;
FIG. 21 is a left side elevational view thereof;
FIG. 22 is a right side elevational view thereof;
FIG. 23 is a top plan view thereof; and
FIG. 24 is a bottom plan view thereof.
FIG. 25 is a perspective view of a fifth embodiment of an earphone
showing our new design;
FIG. 26 is a front elevational view thereof;
FIG. 27 is a left side elevational view thereof;
FIG. 28 is a right side elevational view thereof;
FIG. 29 is a top plan view thereof; and,
FIG. 30 is a bottom plan view thereof.
Portions in broken lines are for illustrative purposes only and do
not form the claimed invention.
* * * * *