Preheater for melting solder

Sugiyama September 4, 2

Patent Grant D666645

U.S. patent number D666,645 [Application Number D/378,913] was granted by the patent office on 2012-09-04 for preheater for melting solder. This patent grant is currently assigned to Hakko Corporation. Invention is credited to Tomomi Sugiyama.


United States Patent D666,645
Sugiyama September 4, 2012

Preheater for melting solder

Claims

CLAIM The ornamental design for a preheater for melting solder, as shown and described.
Inventors: Sugiyama; Tomomi (Osaka, JP)
Assignee: Hakko Corporation (Osaka, JP)
Appl. No.: D/378,913
Filed: November 11, 2010

Foreign Application Priority Data

May 28, 2010 [JP] D2010-013173
Current U.S. Class: D15/144.2; 15/30
Current International Class: 1509
Field of Search: ;D8/29.1,30 ;D13/123,133 ;D15/144,144.1,144.2 ;219/125.1,130.5,132,240,616 ;228/8,20,20.5,40,46,51,111.5

References Cited [Referenced By]

U.S. Patent Documents
4418268 November 1983 Munshaw
D274819 July 1984 Bouman
D274882 July 1984 Rittmann
D290927 July 1987 Pagani
5048742 September 1991 Fortune
D398016 September 1998 Neef
D415435 October 1999 Yoshimura
D445812 July 2001 Shimizu et al.
D490448 May 2004 Ishihara
D550731 September 2007 Ishihara et al.
D620328 July 2010 Masaki

Other References

American Hakko Products, Inc., catalog publication for "FR-1012 Board Preheater", Apr. 2008. cited by other.

Primary Examiner: Palasik; Patricia
Attorney, Agent or Firm: Squire Sanders (US) LLP

Description



FIG. 1 is a perspective view of a preheater for melting solder;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a sectional view thereof, taken along line 8-8 in FIG. 2; and,

FIG. 9 is a sectional view thereof, taken along line 9-9 in FIG. 4.

The portion shown by broken lines is for illustrative purposes only and forms no part of the claimed design.

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