U.S. patent number D666,645 [Application Number D/378,913] was granted by the patent office on 2012-09-04 for preheater for melting solder.
This patent grant is currently assigned to Hakko Corporation. Invention is credited to Tomomi Sugiyama.
United States Patent |
D666,645 |
Sugiyama |
September 4, 2012 |
Preheater for melting solder
Claims
CLAIM The ornamental design for a preheater for melting solder, as
shown and described.
Inventors: |
Sugiyama; Tomomi (Osaka,
JP) |
Assignee: |
Hakko Corporation (Osaka,
JP)
|
Appl.
No.: |
D/378,913 |
Filed: |
November 11, 2010 |
Foreign Application Priority Data
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May 28, 2010 [JP] |
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D2010-013173 |
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Current U.S.
Class: |
D15/144.2;
15/30 |
Current International
Class: |
1509 |
Field of
Search: |
;D8/29.1,30 ;D13/123,133
;D15/144,144.1,144.2 ;219/125.1,130.5,132,240,616
;228/8,20,20.5,40,46,51,111.5 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
American Hakko Products, Inc., catalog publication for "FR-1012
Board Preheater", Apr. 2008. cited by other.
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Primary Examiner: Palasik; Patricia
Attorney, Agent or Firm: Squire Sanders (US) LLP
Description
FIG. 1 is a perspective view of a preheater for melting solder;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a sectional view thereof, taken along line 8-8 in FIG. 2;
and,
FIG. 9 is a sectional view thereof, taken along line 9-9 in FIG.
4.
The portion shown by broken lines is for illustrative purposes only
and forms no part of the claimed design.
* * * * *