Headphone

Description

FIG. 1 is a perspective view showing my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a headphone, as shown.

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Inventors:	Weedon; Mark Craig (New Territories, HK)
Assignee:	Koninklijke Philips Electronics N.V. (Eindhoven, NL)
Appl. No.:	D/394,843
Filed:	June 22, 2011

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Foreign Application Priority Data

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Dec 22, 2010 [EM]			001797382-0001

Current U.S. Class:	D14/223
Current International Class:	1401
Field of Search:	;D14/205,206,223 ;181/129,130,135 ;379/430,420.01,420.02,420.03,420.04 ;381/380,381 ;455/90.3,575.1

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References Cited [Referenced By]

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U.S. Patent Documents

5363444	November 1994	Norris
D567217	April 2008	Kamo et al.
D572703	July 2008	Ledbetter et al.
D573978	July 2008	Ledbetter et al.
D576154	September 2008	Ledbetter et al.
D587681	March 2009	Yanai
D587685	March 2009	Densho
D589493	March 2009	Densho
D594441	June 2009	Lee et al.
7551748	June 2009	Kamo et al.
D598894	August 2009	Masuda et al.
D599778	September 2009	Ando
D623171	September 2010	Chen et al.
D627764	November 2010	Tsai et al.
D628193	November 2010	Zheng
D629395	December 2010	Lee et al.
D642262	July 2011	Wagner
D643416	August 2011	Chong et al.

Primary Examiner: Greene; Paula