High-density emitter package

Andrews , et al. April 24, 2

Patent Grant D658139

U.S. patent number D658,139 [Application Number D/384,360] was granted by the patent office on 2012-04-24 for high-density emitter package. This patent grant is currently assigned to Cree, Inc.. Invention is credited to Amber C. Abare, Peter Scott Andrews, Jeffrey C. Britt, David T. Emerson, Michael P. Laughner, Raymond Rosado.


United States Patent D658,139
Andrews ,   et al. April 24, 2012

High-density emitter package

Claims

CLAIM We claim the ornamental design for a high-density emitter package, as shown and described.
Inventors: Andrews; Peter Scott (Durham, NC), Rosado; Raymond (Apex, NC), Laughner; Michael P. (Cary, NC), Emerson; David T. (Chapel Hill, NC), Abare; Amber C. (Durham, NC), Britt; Jeffrey C. (Cary, NC)
Assignee: Cree, Inc. (Durham, NC)
Appl. No.: D/384,360
Filed: January 31, 2011

Current U.S. Class: D13/180
Current International Class: 1303
Field of Search: ;D13/180 ;D26/1,2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

References Cited [Referenced By]

U.S. Patent Documents
7213940 May 2007 Van De Ven et al.
D615504 May 2010 Keller et al.
D631020 January 2011 Chuang et al.
D650343 December 2011 Andrews et al.
2009/0108281 April 2009 Keller et al.
2009/0283787 November 2009 Donofrio et al.
2010/0140633 June 2010 Emerson
2010/0140634 June 2010 van de Ven et al.
2010/0252851 October 2010 Emerson et al.
2011/0062482 March 2011 Solomensky et al.
2011/0127912 June 2011 Lee et al.
2011/0248289 October 2011 Hsieh et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Phillips; Steven B. Moore & Van Allen PLLC

Description



FIG. 1 is a top perspective view showing an embodiment of our design for a high-density emitter package.

FIG. 2 is a top view of the embodiment of our design shown in FIG. 1.

FIG. 3 is a side view of the embodiment of our design shown in FIG. 1.

FIG. 4 is another side view of the embodiment of our design as shown in FIG. 1.

FIG. 5 is a bottom perspective view of the embodiment of our design shown in FIG. 1.

FIG. 6 is another side view of the embodiment of our design as shown in FIG. 1.

FIG. 7 is another side view of the embodiment of our design as shown in FIG. 1.

FIG. 8 is a bottom view of the embodiment of our design as shown in FIG. 1.

FIG. 9 is a top perspective view showing an alternate environment thereof;

FIG. 10 is a top view thereof;

FIG. 11 is a side view thereof;

FIG. 12 is another side view thereof;

FIG. 13 is a bottom perspective view thereof;

FIG. 14 is another side view thereof;

FIG. 15 is another side view thereof; and,

FIG. 16 is a bottom view thereof.

The broken lines in the drawing views is for the purpose of illustrating environmental structure and forms no part of the claimed design.

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