Shaft portion of an apparatus for holding and heating semiconductor wafers or the like

Nakamura October 25, 2

Patent Grant D647549

U.S. patent number D647,549 [Application Number D/323,537] was granted by the patent office on 2011-10-25 for shaft portion of an apparatus for holding and heating semiconductor wafers or the like. This patent grant is currently assigned to NGK Insulators, Ltd.. Invention is credited to Taichi Nakamura.


United States Patent D647,549
Nakamura October 25, 2011

Shaft portion of an apparatus for holding and heating semiconductor wafers or the like

Claims

CLAIM The ornamental design for a shaft portion of an apparatus for holding and heating semiconductor wafers or the like, as shown and described.
Inventors: Nakamura; Taichi (Nagoya, JP)
Assignee: NGK Insulators, Ltd. (Nagoya, JP)
Appl. No.: D/323,537
Filed: August 27, 2008

Foreign Application Priority Data

Feb 29, 2008 [JP] 2008-004939
Current U.S. Class: D15/144.1
Current International Class: 1509
Field of Search: ;D15/138,140,144.1,199 ;438/584,689,692 ;451/288,289,388

References Cited [Referenced By]

U.S. Patent Documents
1211278 January 1917 Blum
2252553 August 1941 Campbell
D205678 September 1966 Williams
D235282 June 1975 Langston, Jr.
D242745 December 1976 Langston, Jr.
D319524 September 1991 Antonacci
5074343 December 1991 Tyree, Jr.
5195567 March 1993 Tyree, Jr.
D376608 December 1996 Africano
D423340 April 2000 Sittig
6562270 May 2003 Gannon et al.
6695687 February 2004 Hollatz et al.
6889826 May 2005 Harada et al.
D569176 May 2008 Bodum
2003/0075639 April 2003 Kotzur et al.
2003/0104698 June 2003 Taniguchi et al.
2007/0111490 May 2007 Okubo et al.
2008/0011738 January 2008 Yoshie
2009/0098742 April 2009 Timans
2010/0024110 February 2010 St. John
2010/0077541 April 2010 Stein
Foreign Patent Documents
2005-268624 Sep 2005 JP
D1345656 Oct 2008 JP
M298774 Oct 2006 TW
D118408 Aug 2007 TW
Primary Examiner: Palasik; Patricia
Attorney, Agent or Firm: Burr & Brown

Description



FIG. 1 is a perspective view of a shaft portion of an apparatus for holding and heating semiconductor wafers or the like;

FIG. 2 is a front view thereof, a rear view being the same image of a front view;

FIG. 3 is a right side view thereof, a left side view being the same image of a right side view;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a sectional view taken vertically at the center of the portion shown by 5--5 in FIG. 2.

The broken lines showing on the drawing disclosure are for illustrative purposes only and form no part of the claimed design. The lines consisting of long lines and dots indicate conceptual border lines between the claimed portions and the disclaimed portions.

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