Shaft portion of an apparatus for holding and heating semiconductor wafers or the like

Nakamura September 27, 2

Patent Grant D645889

U.S. patent number D645,889 [Application Number D/323,536] was granted by the patent office on 2011-09-27 for shaft portion of an apparatus for holding and heating semiconductor wafers or the like. This patent grant is currently assigned to NGK Insulators, Ltd.. Invention is credited to Taichi Nakamura.


United States Patent D645,889
Nakamura September 27, 2011

Shaft portion of an apparatus for holding and heating semiconductor wafers or the like

Claims

CLAIM The ornamental design for a shaft portion of an apparatus for holding and heating semiconductor wafers or the like, as shown and described.
Inventors: Nakamura; Taichi (Nagoya, JP)
Assignee: NGK Insulators, Ltd. (Nagoya, JP)
Appl. No.: D/323,536
Filed: August 27, 2008

Foreign Application Priority Data

Feb 29, 2008 [JP] 2008-004938
Current U.S. Class: D15/144.1
Current International Class: 1509
Field of Search: ;D15/138,140,144.1,199 ;438/584,689,692 ;451/288,289,388

References Cited [Referenced By]

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Foreign Patent Documents
D1345656 Oct 2008 JP
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Primary Examiner: Palasik; Patricia
Attorney, Agent or Firm: Burr & Brown

Description



FIG. 1 is a perspective view of a shaft portion of an apparatus for holding and heating semiconductor wafers or the like;

FIG. 2 is a front view thereof, a rear view being the same image of a front view;

FIG. 3 is a right side view thereof, a left side view being the same image of a right side view;

FIG. 4 is a bottom plan view thereof; and,

FIG. 5 is a sectional view taken vertically at the center of the portion shown by 5-5 in FIG. 2.

The broken lines showing on the drawing disclosure are for illustrative purposes only and form no part of the claimed design. The lines consisting of long lines and dots indicate conceptual border lines between the claimed portions and the disclaimed portions.

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