Stamp mount cover

Shih January 11, 2

Patent Grant D630677

U.S. patent number D630,677 [Application Number D/375,204] was granted by the patent office on 2011-01-11 for stamp mount cover. This patent grant is currently assigned to Sun Same Enterprises Co., Ltd.. Invention is credited to Hsu-Shen Shih.


United States Patent D630,677
Shih January 11, 2011

Stamp mount cover

Claims

CLAIM The ornamental design for a stamp mount cover, as shown and described.
Inventors: Shih; Hsu-Shen (Tainan, TW)
Assignee: Sun Same Enterprises Co., Ltd. (Yongkang, Tainan Hsien, TW)
Appl. No.: D/375,204
Filed: September 18, 2010

Related U.S. Patent Documents

Application Number Filing Date Patent Number Issue Date
29342688 Aug 28, 2009

Current U.S. Class: D18/18
Current International Class: 1902
Field of Search: ;D18/53,55,39,54,38,15-19 ;399/81,107,151,139 ;101/131,287,333,368 ;D14/303 ;400/611-629 ;347/86

References Cited [Referenced By]

U.S. Patent Documents
3158096 November 1964 Arnold
4996921 March 1991 Hong
D346396 April 1994 Sculler
5647278 July 1997 Wu
5870953 February 1999 Winston
5992319 November 1999 Hsu
D446542 August 2001 Suto
D459386 June 2002 Pichler
D497629 October 2004 Kuhr
7635180 December 2009 Hattori et al.
Primary Examiner: Rademaker; Charles A
Attorney, Agent or Firm: Su IP Consulting

Description



FIG. 1 is a top perspective view of the stamp mount cover in accordance with my design.

FIG. 2 is a bottom perspective view thereof.

FIG. 3 is a top elevation view thereof.

FIG. 4 is a right side elevation view thereof.

FIG. 5 is a left side elevation view thereof.

FIG. 6 is a front elevation view thereof.

FIG. 7 is a rear elevation view thereof; and,

FIG. 8 is a bottom elevation view thereof.

The broken lines showing environment structure are for illustrative purposes and form no part of the claimed design.

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