U.S. patent number D630,677 [Application Number D/375,204] was granted by the patent office on 2011-01-11 for stamp mount cover.
This patent grant is currently assigned to Sun Same Enterprises Co., Ltd.. Invention is credited to Hsu-Shen Shih.
United States Patent |
D630,677 |
Shih |
January 11, 2011 |
Stamp mount cover
Claims
CLAIM The ornamental design for a stamp mount cover, as shown and
described.
Inventors: |
Shih; Hsu-Shen (Tainan,
TW) |
Assignee: |
Sun Same Enterprises Co., Ltd.
(Yongkang, Tainan Hsien, TW)
|
Appl.
No.: |
D/375,204 |
Filed: |
September 18, 2010 |
Related U.S. Patent Documents
|
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
29342688 |
Aug 28, 2009 |
|
|
|
|
Current U.S.
Class: |
D18/18 |
Current International
Class: |
1902 |
Field of
Search: |
;D18/53,55,39,54,38,15-19 ;399/81,107,151,139 ;101/131,287,333,368
;D14/303 ;400/611-629 ;347/86 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Rademaker; Charles A
Attorney, Agent or Firm: Su IP Consulting
Description
FIG. 1 is a top perspective view of the stamp mount cover in
accordance with my design.
FIG. 2 is a bottom perspective view thereof.
FIG. 3 is a top elevation view thereof.
FIG. 4 is a right side elevation view thereof.
FIG. 5 is a left side elevation view thereof.
FIG. 6 is a front elevation view thereof.
FIG. 7 is a rear elevation view thereof; and,
FIG. 8 is a bottom elevation view thereof.
The broken lines showing environment structure are for illustrative
purposes and form no part of the claimed design.
* * * * *