LED package

Lin , et al. July 6, 2

Patent Grant D619110

U.S. patent number D619,110 [Application Number D/350,629] was granted by the patent office on 2010-07-06 for led package. This patent grant is currently assigned to Lite-On Technology Corporation, Silitek Electronic (Guangzhou) Co., Ltd.. Invention is credited to Chen-Hsiu Lin, Tai-Wen Tsai, Chia-Hao Wu.


United States Patent D619,110
Lin ,   et al. July 6, 2010

LED package

Claims

CLAIM The ornamental design for a "LED package," as shown and described.
Inventors: Lin; Chen-Hsiu (Tucheng, TW), Tsai; Tai-Wen (Taipei, TW), Wu; Chia-Hao (Taipei, TW)
Assignee: Silitek Electronic (Guangzhou) Co., Ltd. (Guangzhou, CN)
Lite-On Technology Corporation (Taipei, TW)
Appl. No.: D/350,629
Filed: November 20, 2009

Current U.S. Class: D13/180
Current International Class: 1303
Field of Search: ;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800

References Cited [Referenced By]

U.S. Patent Documents
D563333 March 2008 Kim et al.
D570796 June 2008 Kim
D573114 July 2008 Min et al.
D576573 September 2008 Kobayakawa
D592160 May 2009 Kang et al.
D599750 September 2009 Kim et al.
2009/0236618 September 2009 Yasuda
2010/0059782 March 2010 Fujitomo et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Rabin & Berdo, P.C.

Description



FIG. 1 is a perspective view of a "LED package" showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line showing of structural features is included for the purpose of illustrating non-claimed subject matter and forms no part of the claimed design.

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