Heat dissipation device Patent Grant Chang , et al. May 25, 2 [Foxsemicon Integrated Technology, Inc.]

Heat dissipation device

Chang , et al. May 25, 2

Patent Grant D616378

U.S. patent number D616,378 [Application Number D/344,031] was granted by the patent office on 2010-05-25 for heat dissipation device. This patent grant is currently assigned to Foxsemicon Integrated Technology, Inc.. Invention is credited to Hsueh-Chen Chang, Ming-Chin Chien, Shan-Ju Lin.

United States Patent	D616,378
Chang , et al.	May 25, 2010

Heat dissipation device

Claims

CLAIM The ornamental design for a heat dissipation device, as shown.

Inventors:	Chang; Hsueh-Chen (Miao-Li Hsien, TW), Chien; Ming-Chin (Miao-Li Hsien, TW), Lin; Shan-Ju (Miao-Li Hsien, TW)
Assignee:	Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien, TW)
Appl. No.:	D/344,031
Filed:	September 22, 2009

Foreign Application Priority Data


Jun 18, 2009 [CN]			2009 3 03036490.8

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719

References Cited [Referenced By]

U.S. Patent Documents


D285301	August 1986	Johnson
5574626	November 1996	Smith
D402025	December 1998	Dodson
6295202	September 2001	Tucker et al.
6343014	January 2002	Lin
2003/0183373	October 2003	Sarraf et al.
2004/0104021	June 2004	Kujirai
2007/0272400	November 2007	Abul-Haj et al.
2009/0139690	June 2009	Maerz et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Chew; Raymond J.

Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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