Headset earphone assembly

Martin October 20, 2

Patent Grant D602475

U.S. patent number D602,475 [Application Number D/327,230] was granted by the patent office on 2009-10-20 for headset earphone assembly. Invention is credited to Michael Joseph Martin.


United States Patent D602,475
Martin October 20, 2009

Headset earphone assembly

Claims

CLAIM The ornamental design for a headset earphone assembly, as shown and described.
Inventors: Martin; Michael Joseph (Los Angeles, CA)
Appl. No.: D/327,230
Filed: November 1, 2008

Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/205,206,223 ;379/430,433.01 ;181/129,130,135 ;381/370,371,380,381 ;D24/174 ;D23/209

References Cited [Referenced By]

U.S. Patent Documents
3934100 January 1976 Harada
D355702 February 1995 Johnson
D430060 August 2000 Kavalek
D519109 April 2006 Perszyk et al.
D550657 September 2007 Gan et al.
D556326 November 2007 Espersen
D589151 March 2009 Sabio
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Tarver; Edwin Lauson & Tarver LLP

Description



FIG. 1 is a perspective view of a headset earphone assembly showing my new design.

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a rear elevational view thereof; and,

FIG. 5 is a front elevational view thereof.

All parts of the figures shown in dashed line are not part of the claimed design.

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