U.S. patent number D593,963 [Application Number D/317,124] was granted by the patent office on 2009-06-09 for modular heat sink. This patent grant is currently assigned to 4187318 Canada Inc.. Invention is credited to Eihab Baqui, Sharath Kumar, Eran Plonski.
United States Patent | D593,963 |
Plonski , et al. | June 9, 2009 |
Inventors: | Plonski; Eran (Montreal, CA), Kumar; Sharath (Laval, CA), Baqui; Eihab (Brossard, CA) |
---|---|
Assignee: | 4187318 Canada Inc.
(Saint-Laurent, Quebec, CA) |
Appl. No.: | D/317,124 |
Filed: | April 23, 2008 |
Current U.S. Class: | D13/179 |
Current International Class: | 1303 |
Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
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D579421 | October 2008 | Chu |
D579422 | October 2008 | Shuai et al. |
2004/0244948 | December 2004 | Luo |
2006/0213642 | September 2006 | Lai |
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