Earhook and earbud headset

Williams , et al. May 26, 2

Patent Grant D593075

U.S. patent number D593,075 [Application Number D/318,102] was granted by the patent office on 2009-05-26 for earhook and earbud headset. This patent grant is currently assigned to Societe BIC. Invention is credited to David Robert Gray, Jordan B. Nollman, Marco Perry, William Webb, Jason Martin Williams.


United States Patent D593,075
Williams ,   et al. May 26, 2009

Earhook and earbud headset

Claims

CLAIM What is claimed is the ornamental design for an earhook and earbud headset, as shown and described.
Inventors: Williams; Jason Martin (Sandy Hook, CT), Gray; David Robert (Milford, CT), Perry; Marco (Brooklyn, NY), Nollman; Jordan B. (San Francisco, CA), Webb; William (San Francisco, CA)
Assignee: Societe BIC (FR)
Appl. No.: D/318,102
Filed: May 13, 2008

Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/205,206,223,188,192,142,240 ;181/129,130 ;381/380,381,385,370,374,376,377,378,379,330 ;379/430 ;455/575.1,575.2,569.1

References Cited [Referenced By]

U.S. Patent Documents
D311521 October 1990 Jonsson et al.
D420010 February 2000 Pitel
D421755 March 2000 Pitel
D441739 May 2001 Hayes et al.
D465209 November 2002 Rath
D470129 February 2003 Hlas et al.
D471537 March 2003 Ham
D494568 August 2004 Pan
D501196 January 2005 Dyer et al.
D543968 June 2007 Wong
D556740 December 2007 Xavier
D566104 April 2008 Suzuki
D573137 July 2008 Polito
D575772 August 2008 Schultz et al.
D581395 November 2008 Sade et al.
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Cantor Colburn LLP

Description



FIG. 1 is an outside elevation view of one embodiment of the headset of our new design with the input wire to the earbud broken away;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is an inside elevation view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is an outside elevation view of a second embodiment of the headset of our new design with the input wire to the earbud broken away;

FIG. 9 is a top view thereof;

FIG. 10 is a bottom view thereof;

FIG. 11 is a front elevation view thereof;

FIG. 12 is a rear elevation view thereof; and,

FIG. 13 is an inside elevation view thereof.

* * * * *


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