Housing for an electronic device

L'Henaff , et al. May 19, 2

Patent Grant D592649

U.S. patent number D592,649 [Application Number D/266,026] was granted by the patent office on 2009-05-19 for housing for an electronic device. This patent grant is currently assigned to Audiovox Electronics Corporation. Invention is credited to William Cowles, Jean-Jacques L'Henaff.


United States Patent D592,649
L'Henaff ,   et al. May 19, 2009

Housing for an electronic device

Claims

CLAIM The ornamental design for a housing for an electronic device, as shown and described.
Inventors: L'Henaff; Jean-Jacques (Pelham, NY), Cowles; William (Brooklyn, NY)
Assignee: Audiovox Electronics Corporation (Hauppauge, NY)
Appl. No.: D/266,026
Filed: September 13, 2006

Current U.S. Class: D14/240
Current International Class: 1403
Field of Search: ;D14/356,358,233,240,242,300,348,388,433,218 ;D13/184,199,100,137.2 ;360/69 ;379/220.1,220.14,25,93.09,93.15,156,900,338,329 ;381/124 ;607/36 ;455/550.1

References Cited [Referenced By]

U.S. Patent Documents
D460443 July 2002 Brunner et al.
D463411 September 2002 Stokes et al.
D464337 October 2002 Arpe
D480716 October 2003 Saikawa et al.
D494157 August 2004 Wikel et al.
D494575 August 2004 Wikel et al.
D519099 April 2006 Liu et al.
D533542 December 2006 Suzuki et al.
D548728 August 2007 Yoshiyama
D554625 November 2007 Kato
2004/0224717 November 2004 Hertzberg et al.
Primary Examiner: Rademaker; Charles A
Attorney, Agent or Firm: Bodner; Gerald T.

Description



FIG. 1 is a top perspective view of a housing for an electronic device showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a front elevational view thereof;

FIG. 7 is a right elevational view thereof; and,

FIG. 8 is a left elevational view thereof.

The broken lines are for illustrative purposes only and form no part of the claimed design.

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