Electronic signature pad

Guenther February 17, 2

Patent Grant D586812

U.S. patent number D586,812 [Application Number D/293,029] was granted by the patent office on 2009-02-17 for electronic signature pad. This patent grant is currently assigned to StepOver GmbH. Invention is credited to Andreas Guenther.


United States Patent D586,812
Guenther February 17, 2009

Electronic signature pad

Claims

CLAIM The ornamental design for an electronic signature pad, as shown and described.
Inventors: Guenther; Andreas (Stuttgart, DE)
Assignee: StepOver GmbH (Stuttgart, DE)
Appl. No.: D/293,029
Filed: November 7, 2007

Foreign Application Priority Data

May 8, 2007 [DE] 4 07 02 450
Current U.S. Class: D14/383
Current International Class: 1402
Field of Search: ;D14/341-346,383-387 ;D18/4.4,4.6,6,7 ;382/115,116,119,124,126 ;346/71 ;235/382,382.5 ;345/169,173 ;361/681-686

References Cited [Referenced By]

U.S. Patent Documents
D307134 April 1990 Makidera
5103486 April 1992 Grippi
5375226 December 1994 Sano et al.
6177926 January 2001 Kunert
6757156 June 2004 Adams et al.
D532009 November 2006 Zank et al.
2002/0129257 September 2002 Parmelee et al.
2003/0132918 July 2003 Fitch et al.
Foreign Patent Documents
2 373 220 Nov 2000 CA
198 11 930 Sep 1999 DE
198 59 932 Jun 2000 DE
10 2006 000 859 Jul 2007 DE

Other References

http://www.interlinkelectronics.com/library/media/papers/pdf/ePad%20family- %20Brochure%202006.pdf, Interlink Electronics, Inc., pp. 1-4, 2007, Camarillo, CA 93012. cited by other .
http://www.topazsystems.com/products/specs/SigGemColor57.pdf, Topaz Systems, Inc., pp. 1-2, 2003-2006, Simi Valley, CA 93065. cited by other .
http://www.topazsystems.com/products/index.htm, Electronic signature pad options, p. 1, 2003-2005, Simi Valley, CA 93065. cited by other .
U.S. Appl. No. 11/964,293, filed Dec. 26, 2007, Guenther. cited by other.

Primary Examiner: Nunn; Freda S
Attorney, Agent or Firm: Simpson & Simpson, PLLC

Description



FIG. 1 is a perspective view of an electronic signature pad of the present invention;

FIG. 2 is a front elevational view of the electronic signature pad;

FIG. 3 is a back elevational view of the electronic signature pad;

FIG. 4 is a top plan view of the electronic signature pad;

FIG. 5 is a bottom plan view of the electronic signature pad;

FIG. 6 is a right side elevational view of the electronic signature pad; and,

FIG. 7 is a left side elevational view of the electronic signature pad.

The broken lines shown are for illustrative purposes only and form no part of the claimed design.

* * * * *

References


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