U.S. patent number D576,987 [Application Number D/287,447] was granted by the patent office on 2008-09-16 for mobile phone. This patent grant is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Jong-Seong Lee, Yusuru Masuda, Keiichi Minamide.
United States Patent | D576,987 |
Minamide , et al. | September 16, 2008 |
Inventors: | Minamide; Keiichi (Tokyo, JP), Lee; Jong-Seong (Seoul, KR), Masuda; Yusuru (Tokyo, JP) |
---|---|
Assignee: | Samsung Electronics Co., Ltd.
(Suwon-Si, KR) |
Appl. No.: | D/287,447 |
Filed: | August 9, 2007 |
Jun 18, 2007 [KR] | 30-2007-0026036 | |||
Current U.S. Class: | D14/138AB |
Current International Class: | 1403 |
Field of Search: | ;D14/138,496,341-347 ;455/575.3,575.1 |
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