U.S. patent number D572,697 [Application Number D/287,898] was granted by the patent office on 2008-07-08 for mobile phone. This patent grant is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Chang-Hwan Hwang, Sang-Min Hyun, Ji-Young Lee.
United States Patent | D572,697 |
Lee , et al. | July 8, 2008 |
Inventors: | Lee; Ji-Young (Seoul, KR), Hyun; Sang-Min (Seoul, KR), Hwang; Chang-Hwan (Goyang-si, KR) |
---|---|
Assignee: | Samsung Electronics Co., Ltd.
(Suwon-Si, KR) |
Appl. No.: | D/287,898 |
Filed: | September 28, 2007 |
Jul 24, 2007 [KR] | 30-2007-0031865 | |||
Current U.S. Class: | D14/138AA; D14/346 |
Current International Class: | 1403 |
Field of Search: | ;D14/137-138,147-148,156,218,247-248,341-347,390,399,455,456,496 ;D16/208 ;D21/329,331,333,517 ;348/14.01-14.02 ;361/814 ;379/433.01-433.13 ;455/90.3,556.1-556.2,566,575.1,575.3,575.4 ;D13/164,168 ;439/165 ;343/702 |
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