Enclosure for electronic components

Fischer , et al. May 13, 2

Patent Grant D568841

U.S. patent number D568,841 [Application Number D/275,334] was granted by the patent office on 2008-05-13 for enclosure for electronic components. This patent grant is currently assigned to ADC Telecommunications, Inc.. Invention is credited to Larry G. Fischer, Michael J. Hermel, Gregory Martell, Eric S. Moreau.


United States Patent D568,841
Fischer ,   et al. May 13, 2008

Enclosure for electronic components

Claims

CLAIM The ornamental design for an enclosure for electronic components, as shown and described.
Inventors: Fischer; Larry G. (Waseca, MN), Hermel; Michael J. (Waseca, MN), Moreau; Eric S. (St. Peter, MN), Martell; Gregory (Chanhassen, MN)
Assignee: ADC Telecommunications, Inc. (Eden Prairie, MN)
Appl. No.: D/275,334
Filed: December 21, 2006

Current U.S. Class: D13/184
Current International Class: 1303
Field of Search: ;D13/184,199,123,152,147 ;D14/299,349,353,356,357,368,433,434,435,240,137,142,358,241,242,243,256,140.1,238 ;455/73,90.3,151.1,347,554.1 ;379/413.04,428.01,447 ;220/4.01 ;174/16.3 ;361/704,274.3,271,697,702,709-711,719,720,514

References Cited [Referenced By]

U.S. Patent Documents
4656559 April 1987 Fathi
5065278 November 1991 Schultz
5089935 February 1992 Ito
5150278 September 1992 Lynes et al.
D336074 June 1993 Friend et al.
5267122 November 1993 Glover et al.
D379088 May 1997 Hopper
5898412 April 1999 Jones et al.
D410652 June 1999 Jones et al.
D414774 October 1999 Gauffin
D416873 November 1999 Korsunsky et al.
D418515 January 2000 Tucker et al.
6354461 March 2002 Tenney et al.
D458228 June 2002 Jacobson
D462675 September 2002 Kusz et al.
6587339 July 2003 Daniels et al.
6628521 September 2003 Gustine et al.
6781830 August 2004 Barth et al.
6862180 March 2005 Sawyer et al.
2002/0054481 May 2002 Gustine et al.
2003/0078015 April 2003 Laetsch
Primary Examiner: Spear; Robert M.
Assistant Examiner: Dworzecka; Anna K
Attorney, Agent or Firm: Fogg & Powers LLC Taylor; Gregory M.

Description



FIG. 1 is an elevated perspective view of an enclosure for electronic components incorporating a design according to the invention.

FIG. 2 is a left side view of the enclosure of FIG. 1.

FIG. 3 is a right side view of the enclosure of FIG. 1.

FIG. 4 is an end view of the enclosure of FIG. 1; and,

FIG. 5 is a bottom view of the enclosure of FIG. 1.

* * * * *


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