U.S. patent number D559,270 [Application Number D/274,117] was granted by the patent office on 2008-01-08 for pump.
This patent grant is currently assigned to Mitsumi Electric Co., Ltd.. Invention is credited to Tanemichi Fukui, Riichiro Hibiya, Kenichi Hori, Kensuke Yamada.
United States Patent |
D559,270 |
Hori , et al. |
January 8, 2008 |
Pump
Claims
CLAIM The ornamental design for a pump, as shown and described.
Inventors: |
Hori; Kenichi (Tokyo,
JP), Fukui; Tanemichi (Tokyo, JP), Hibiya;
Riichiro (Tokyo, JP), Yamada; Kensuke (Tokyo,
JP) |
Assignee: |
Mitsumi Electric Co., Ltd.
(Tokyo, JP)
|
Appl.
No.: |
D/274,117 |
Filed: |
March 29, 2007 |
Foreign Application Priority Data
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Nov 10, 2006 [JP] |
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2006-030885 |
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Current U.S.
Class: |
D15/7 |
Current International
Class: |
1502 |
Field of
Search: |
;D15/7-9 ;D23/232,231
;417/359,415-416,410.1,321,265,405 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Seifert; Ralf
Attorney, Agent or Firm: Sughrue Mion, PLLC
Description
FIG. 1 is a perspective view of the top, front and right side of a
pump showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top/plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The portions shown in broken lines are for illustrative purposes
only and form no part of the claimed design.
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