U.S. patent number D558,971 [Application Number D/186,849] was granted by the patent office on 2008-01-08 for periphery of a shoe sole. This patent grant is currently assigned to Jack Schwartz Shoes, Inc.. Invention is credited to Raymond V. Wu.
United States Patent | D558,971 |
Wu | January 8, 2008 |
Inventors: | Wu; Raymond V. (New York, NY) |
---|---|
Assignee: | Jack Schwartz Shoes, Inc. (New
York, NY) |
Appl. No.: | D/186,849 |
Filed: | July 23, 2003 |
Current U.S. Class: | D2/977 |
Current International Class: | 0401 |
Field of Search: | ;D2/896,902,907,908,916,947,951,954,957,958,959,960,969,972 ;32/134,3B,24.5,25R,32R,43 |
D385987 | November 1997 | Bramani |
D391748 | March 1998 | Koh |
D399345 | October 1998 | Koh |
D401045 | November 1998 | Greenberg |
D453616 | February 2002 | Sakai |
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