U.S. patent number D550,731 [Application Number D/272,075] was granted by the patent office on 2007-09-11 for preheater for melting solder.
This patent grant is currently assigned to Hakko Corporation. Invention is credited to Toshinobu Ishihara, Tomomi Sugiyama.
United States Patent |
D550,731 |
Ishihara , et al. |
September 11, 2007 |
Preheater for melting solder
Claims
CLAIM The ornamental design for a preheater for melting solder, as
shown and described.
Inventors: |
Ishihara; Toshinobu (Osaka,
JP), Sugiyama; Tomomi (Osaka, JP) |
Assignee: |
Hakko Corporation (Osaka,
JP)
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Appl.
No.: |
D/272,075 |
Filed: |
January 31, 2007 |
Foreign Application Priority Data
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Aug 31, 2006 [JP] |
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D2006-023150 |
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Current U.S.
Class: |
D15/144.2 |
Current International
Class: |
1509 |
Field of
Search: |
;D15/144,144.1,144.2
;219/125.1,130.5,132 ;228/20.5,40,46,51 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Printout of Hakko's website regarding "Hakko 853 Pre-Heater" dated
Aug. 28, 2006. cited by other.
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Primary Examiner: Davis; Antoine D.
Assistant Examiner: Palasik; Patricia
Attorney, Agent or Firm: Squire, Sanders & Dempsey
LLP
Description
FIG. 1 is a perspective view of a preheater for melting solder;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
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