Preheater for melting solder

Ishihara , et al. September 11, 2

Patent Grant D550731

U.S. patent number D550,731 [Application Number D/272,075] was granted by the patent office on 2007-09-11 for preheater for melting solder. This patent grant is currently assigned to Hakko Corporation. Invention is credited to Toshinobu Ishihara, Tomomi Sugiyama.


United States Patent D550,731
Ishihara ,   et al. September 11, 2007

Preheater for melting solder

Claims

CLAIM The ornamental design for a preheater for melting solder, as shown and described.
Inventors: Ishihara; Toshinobu (Osaka, JP), Sugiyama; Tomomi (Osaka, JP)
Assignee: Hakko Corporation (Osaka, JP)
Appl. No.: D/272,075
Filed: January 31, 2007

Foreign Application Priority Data

Aug 31, 2006 [JP] D2006-023150
Current U.S. Class: D15/144.2
Current International Class: 1509
Field of Search: ;D15/144,144.1,144.2 ;219/125.1,130.5,132 ;228/20.5,40,46,51

References Cited [Referenced By]

U.S. Patent Documents
D274882 July 1984 Rittmann
D277636 February 1985 Rittmann
D290927 July 1987 Pagani
5048742 September 1991 Fortune
5411197 May 1995 Nakamura et al.
D398016 September 1998 Neef
D428427 July 2000 Neef
D445812 July 2001 Shimizu et al.
6294759 September 2001 Dunn, Jr.
D490448 May 2004 Ishihara

Other References

Printout of Hakko's website regarding "Hakko 853 Pre-Heater" dated Aug. 28, 2006. cited by other.

Primary Examiner: Davis; Antoine D.
Assistant Examiner: Palasik; Patricia
Attorney, Agent or Firm: Squire, Sanders & Dempsey LLP

Description



FIG. 1 is a perspective view of a preheater for melting solder;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

* * * * *


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