Electronics module assembly

Description

FIG. 1 is a top front left perspective view of an electronics module assembly in accordance with the present invention;

FIG. 2 is an exploded view of the electronics module assembly of FIG. 1;

FIG. 3 is a front plan view thereof;

FIG. 4 is a rear plan view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top elevational view; and,

FIG. 8 is a bottom elevational view thereof.

The broken line showing is for illustrative purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design of an electronics module assembly, as shown and described.

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Inventors:	Sandgren; Daniel J. (Naperville, IL), Clark; Joseph R. (Naperville, IL)
Assignee:	Scientific-Atlanta, Inc. (Lawrenceville, GA)
Appl. No.:	D/229,718
Filed:	May 11, 2005

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Current U.S. Class:	D13/162
Current International Class:	1303
Field of Search:	;D13/158-168,118,122,123,179,171,184 ;D14/371,240,239 ;D10/46,49,96 ;D24/215 ;361/728,729,736,740,752,761 ;315/291,294,295 ;362/559,225 ;700/17-32 ;345/173,156 ;439/761,341

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References Cited [Referenced By]

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U.S. Patent Documents

D274615	July 1984	Bean et al.
D281493	November 1985	Prager et al.
4558914	December 1985	Prager et al.
4672511	June 1987	Meusel et al.
D305230	December 1989	Math
D309600	July 1990	Backes
D338448	August 1993	Onyszko
D345144	March 1994	Thomas
D356996	April 1995	Henderson et al.
6172875	January 2001	Suzuki et al.
D464326	October 2002	Clark et al.
D482691	November 2003	McClelland et al.
D492292	June 2004	Ogren
D501830	February 2005	Kikuchi et al.
6870746	March 2005	Leeson et al.
D537044	February 2007	Weitz et al.
2006/0256541	November 2006	Sandgren et al.

Primary Examiner: Sikder; Selina
Assistant Examiner: Johannes; Thomas