U.S. patent number D542,267 [Application Number D/253,306] was granted by the patent office on 2007-05-08 for headset.
This patent grant is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Seong Won Cha, Joon Suh Kim, Chang Soo Lee.
United States Patent |
D542,267 |
Cha , et al. |
May 8, 2007 |
Headset
Claims
CLAIM The ornamental design for headset, as shown.
Inventors: |
Cha; Seong Won (Seoul,
KR), Kim; Joon Suh (Anyang-Si, KR), Lee;
Chang Soo (Incheon-si, KR) |
Assignee: |
Samsung Electronics Co., Ltd.
(KR)
|
Appl.
No.: |
D/253,306 |
Filed: |
February 3, 2006 |
Foreign Application Priority Data
|
|
|
|
|
Nov 4, 2005 [KR] |
|
|
30-2005-0037209 |
|
Current U.S.
Class: |
D14/206;
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/138,188,192,205,206,223 ;181/129-130 ;379/430,431,432,433,434
;381/381,370,374,375,376,377,378,379,380,385 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula A.
Attorney, Agent or Firm: Keschner; Irving
Description
FIG. 1 is a perspective view of the ornamental design of the
present invention;
FIG. 2 is a front elevational view of the ornamental design of the
present invention;
FIG. 3 is a rear elevational view of the ornamental design of the
present invention;
FIG. 4 is a left side elevational view of the ornamental design of
the present invention;
FIG. 5 is a right side elevational view of the ornamental design of
the present invention;
FIG. 6 is a top plan view of the ornamental design of the present
invention; and,
FIG. 7 is a bottom view of the ornamental design of the present
invention.
* * * * *