Heat sink

Description

This article is used for cooling a heated electronic component such as a CPU which is typically used in a microcomputer and is mounted on the rear of the metallic base.

FIG. 1 is a front side elevation view of the heat sink;

FIG. 2 is a rear side elevation view;

FIG. 3 is a right side elevation view;

FIG. 4 is a left side elevation view;

FIG. 5 is a top plan view;

FIG. 6 is a bottom plan view;

FIG. 7 is a perspective view as viewed from the front;

FIG. 8 is a perspective view as viewed from the rear;

FIG. 9 is a cross sectional view as taken along line 9--9 of FIG. 1; and,

FIG. 10 is a cross sectional view as taken along line 10--10 of FIG. 5.

This article is formed with a plurality of metallic fins which are integrally provided on a metallic base.

Claims

CLAIM The ornamental design for a heat sink, as shown and described.

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Inventors:	Miyazawa; Masashi (Nagano, JP), Ikeda; Tomoaki (Nagano, JP), Ogawara; Toshiki (Nagano, JP)
Assignee:	Sanyo Denki Co., Ltd. (Tokyo, JP)
Appl. No.:	D/242,246
Filed:	November 8, 2005

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Foreign Application Priority Data

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May 12, 2005 [JP]			2005-013654

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;D23/370 ;165/80.3,104.33,121,122,146,180,185 ;174/16.3 ;257/706,707,718-722 ;361/271,274.3,695,697,700,702,704,709-711

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References Cited [Referenced By]

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U.S. Patent Documents

5945736	August 1999	Rife et al.
6446708	September 2002	Lai
6452803	September 2002	Liu
D476958	July 2003	Tsai
D481688	November 2003	Lee et al.
6832410	December 2004	Hegde
6883593	April 2005	Johnson et al.
6913072	July 2005	Luo
7025125	April 2006	Sheng et al.
2002/0195229	December 2002	Hsieh et al.
2005/0247437	November 2005	Ying et al.

Foreign Patent Documents

	480136		Mar 1991		TW
	480137		Mar 1991		TW
	514487		Dec 1991		TW
	514488		Dec 1991		TW

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Rankin, Hill, Porter & Clark LLP