U.S. patent number D526,616 [Application Number D/194,740] was granted by the patent office on 2006-08-15 for modular jack housing.
This patent grant is currently assigned to Matsushita Electric Works, Inc.. Invention is credited to Shousuke Ko, Yoshiyuki Nakashima.
United States Patent |
D526,616 |
Nakashima , et al. |
August 15, 2006 |
Modular jack housing
Claims
CLAIM The ornamental design for a modular jack housing, as shown
and described.
Inventors: |
Nakashima; Yoshiyuki (Kadoma,
JP), Ko; Shousuke (Osaka, JP) |
Assignee: |
Matsushita Electric Works, Inc.
(Osaka, JP)
|
Appl.
No.: |
D/194,740 |
Filed: |
November 25, 2003 |
Foreign Application Priority Data
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|
|
|
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May 26, 2003 [JP] |
|
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2003-01566 |
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Current U.S.
Class: |
D13/133 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/133,146-147,154,184,199 ;D14/240,256,356-358
;439/92,344,607-610,638,650,676 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Reid; Stella
Assistant Examiner: Bui; Daniel
Attorney, Agent or Firm: J.C. Patents
Description
FIG. 1 is a bottom and right front perspective view of a modular
jack housing, showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a right side elevational view thereof, the left side
elevational view being a mirror image of the right side elevational
view.
FIG. 5 is a top plan view thereof.
FIG. 6 is a bottom plan view thereof.
FIG. 7 is a sectional view taken along line 7--7 of FIG. 2 with the
internal parts omitted; and,
FIG. 8 is a sectional view taken along line 8--8 of FIG. 2 with the
internal parts omitted.
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