Modular electronic housing and assemblies
Hahn , et al. April 25, 2
U.S. patent number D519,470 [Application Number D/233,206] was granted by the patent office on 2006-04-25 for modular electronic housing and assemblies. This patent grant is currently assigned to Honeywell International Inc.. Invention is credited to Rod P. Boer, Amand J. Hahn, Eric A. Schneider.
| United States Patent | D519,470 |
| Hahn , et al. | April 25, 2006 |
Modular electronic housing and assemblies
Claims
CLAIM The ornamental design for a modular electronic housing and assemblies, as shown and described.
| Inventors: | Hahn; Amand J. (Lansdale, PA), Boer; Rod P. (Hartboro, PA), Schneider; Eric A. (Erdenheim, PA) |
|---|---|
| Assignee: | Honeywell International Inc.
(Morristown, NJ) |
| Appl. No.: | D/233,206 |
| Filed: | June 28, 2005 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 29195922 | Dec 8, 2003 | D499567 | |||
| Current U.S. Class: | D13/184 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/184 ;D14/240 ;174/50,52.1 ;220/4.02 ;361/600,601,679,688,704,724,796 |
References Cited [Referenced By]
U.S. Patent Documents
| 5842514 | December 1998 | Zapach et al. |
| 6625017 | September 2003 | Lin et al. |
| 6628521 | September 2003 | Gustine et al. |
| 6649830 | November 2003 | Bartlett et al. |
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Miologos; Anthony
Description
The modular electronic housing and assemblies comprises a modular electronic housing intended to be used to house electronic circuit boards and their included electronic components.
The FIGURE is a right side perspective view of a modular electronic housing and assemblies showing our new design.
The broken line disclosure in the drawings are for illustrative purposes only and form no part of the claimed design.
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