Headset body for communications headset

Description

FIG. 1 is a lower front right perspective view of a headset body for communications headset, the broken line drawings of an illustrative microphone boom and a receiver are for illustrative purposes only and form no part of the claimed design.

FIG. 2 is a left side elevational view of the headset body.

FIG. 3 is a right side elevational view of the headset body.

FIG. 4 is a rear elevational view of the headset body.

FIG. 5 is a front elevational view of the headset body.

FIG. 6 is a bottom plan view of the headset body; and,

FIG. 7 is a top plan view of the headset body.

The broken lines are for illustrative purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for a headset body for communications headset, as shown and described.

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Inventors:	Polito; Fred (Santa Cruz, CA), Ham; Soohyun (Santa Cruz, CA), Wilson; Jay (Portola Valley, CA), Richardson; Andy K. (Aptos, CA), Gyotoku; Cliff M. (San Jose, CA)
Assignee:	Plantronics, Inc. (Santa Cruz, CA)
Appl. No.:	D/201,594
Filed:	March 17, 2004

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Current U.S. Class:	D14/223
Current International Class:	1401
Field of Search:	;D14/192,205,206,223,224,249 ;381/381,378,379 ;181/129,130,135 ;D24/174 ;379/430,433

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References Cited [Referenced By]

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U.S. Patent Documents

1556775	October 1925	Fensky
4617431	October 1986	Scott et al.
4741030	April 1988	Wilson
5210792	May 1993	Kajihara
5459290	October 1995	Yamagishi
D375959	November 1996	Davis et al.
6252970	June 2001	Poon et al.
D468299	January 2003	Boesen
D476645	July 2003	Padala et al.
D495685	September 2004	Hirano

Primary Examiner: Greene; Paula A.
Attorney, Agent or Firm: Hsieh; Peter