Optical module

Description

FIG. 1 is a front, top and right side perspective view of a optical module, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical module, showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 13 is a front, top and right side perspective view of a third embodiment of the optical module, showing our new design;

FIG. 14 is a front elevational view thereof;

FIG. 15 is a rear elevational view thereof;

FIG. 16 is a top plan view thereof;

FIG. 17 is a bottom plan view thereof;

FIG. 18 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view therof;

FIG. 19 is a front, top and right side perspective view of a fourth embodiment of the optical module, showing our new design;

FIG. 20 is a front elevational view thereof;

FIG. 21 is a rear elevational view thereof;

FIG. 22 is a top plan view thereof;

FIG. 23 is a bottom plan view thereof; and,

FIG. 24 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.

The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for an optical module, as shown and described.

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Inventors:	Takagi; Shinichi (Tokyo, JP), Aruga; Hiroshi (Tokyo, JP), Sakai; Kiyohide (Tokyo, JP)
Assignee:	Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Appl. No.:	D/173,629
Filed:	January 3, 2003

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Foreign Application Priority Data

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Jul 10, 2002 [JP]			2002-018476
Jul 10, 2002 [JP]			2002-018477
Jul 10, 2002 [JP]			2002-018478
Jul 10, 2002 [JP]			2002-018479
Jul 10, 2002 [JP]			2002-018480
Jul 10, 2002 [JP]			2002-018481
Jul 10, 2002 [JP]			2002-018482

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;257/98,99,433,678 ;372/31,36,43,92 ;385/88,92

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References Cited [Referenced By]

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U.S. Patent Documents

5089861	February 1992	Tanaka et al.
5252856	October 1993	Murai
6157012	December 2000	Tanaka et al.
6181720	January 2001	Kanemoto et al.
D483338	December 2003	Takagi et al.
D484105	December 2003	Takagi et al.
6750535	June 2004	Huang
D494147	August 2004	Takagi et al.
2002/0003705	January 2002	Tanaka
2004/0264888	December 2004	Go

Other References

NEC Corporation Semiconductor Devices, "Data Sheet, Laser Diode NX7313UA NEC", 10 pages, 2002. cited by other . Product Overview, wysiwyg://mainframe.1101/http://www.shinko.co.jp/e.product/e.glass/e.glas- s.4.htm, "Glass-To-Metal Seals", 2 pages, 2001-2002. cited by other . Patent Abstracts of Japan. JP 10-284640, Oct. 23, 1998. cited by other . Patent Abstracts of Japan, JP 08-031970, Feb. 2, 1996. cited by other . Patent Abstracts of Japan, JP 11-087577, Mar. 30, 1999. cited by other . Patent Abstracts of Japan, JP 05-129461, May 25, 1993. cited by other . Patent Abstracts of Japan. JP 07-176649, Jul. 14, 1995. cited by other.

Primary Examiner: Reid; Stella
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.