Headphone

Hirakawa , et al. February 7, 2

Patent Grant D514550

U.S. patent number D514,550 [Application Number D/216,863] was granted by the patent office on 2006-02-07 for headphone. This patent grant is currently assigned to Sony Computer Entertainment Inc.. Invention is credited to Michio Deguchi, Maki Hirakawa.


United States Patent D514,550
Hirakawa ,   et al. February 7, 2006

Headphone

Claims

CLAIM The ornamental design for a headphone, as shown and described.
Inventors: Hirakawa; Maki (Tokyo, JP), Deguchi; Michio (Tokyo, JP)
Assignee: Sony Computer Entertainment Inc. (Tokyo, JP)
Appl. No.: D/216,863
Filed: November 10, 2004

Foreign Application Priority Data

May 10, 2004 [JP] D2004-013697
Current U.S. Class: D14/223
Current International Class: 1401
Field of Search: ;D14/188,192,205,206,217,218,223 ;D2/866,877 ;2/338 ;D10/106 ;D13/168 ;24/265R ;224/178 ;428/121 ;381/370,376-381

References Cited [Referenced By]

U.S. Patent Documents
1799868 April 1931 Sauer, Jr.
3225408 December 1965 Durham
D258433 March 1981 Bulmash et al.
D268675 April 1983 Hass
D399209 October 1998 Yamagishi
D464642 October 2002 Kanno
D466100 November 2002 Obata
Foreign Patent Documents
D1164092 Jan 2003 JP
Primary Examiner: Greene; Paula A.
Attorney, Agent or Firm: Rader, Fishman & Grauer PLLC

Description



FIG. 1 is a perspective view of a headphone showing our new design;

FIG. 2 is a front elevational view thereof, showing lines VII--VII and VII'--VII' are shown;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof, showing lines VIII--VIII and VIII'--VIII', a bottom plan view thereof being a mirror image of the top plan view;

FIG. 7 is a partially enlarged front elevational view, taken along between the lines VII--VII and VII'--VII' shown in FIG. 2, showing lines X--X and XI--XI;

FIG. 8 is a partially enlarged top plan view, taken along between the lines VIII--VIII and VIII'--VIII' shown in FIG. 6;

FIG. 9 is a reduced perspective view, showing a using condition;

FIG. 10 is a reference enlarged cross sectional view, taken along the line X--X shown in FIG. 7; and,

FIG. 11 is a reference enlarged cross sectional view, taken along the line XI--XI shown in FIG. 7.

The broken lines showing of the environment are for illustrative purposes only and form no part of the claimed design.

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