Thermal module
Lin , et al. October 4, 2
U.S. patent number D510,324 [Application Number D/196,439] was granted by the patent office on 2005-10-04 for thermal module. This patent grant is currently assigned to ASUSTek Computer Inc.. Invention is credited to Chih-Yuan Cheng, Chi-Chang Lin, Heng-Tsung Wang.
| United States Patent | D510,324 |
| Lin , et al. | October 4, 2005 |
Thermal module
Claims
The ornamental design for a thermal module, as shown and described.
| Inventors: | Lin; Chi-Chang (Lujhou, TW), Cheng; Chih-Yuan (Banciao, TW), Wang; Heng-Tsung (Taipei, TW) |
|---|---|
| Assignee: | ASUSTek Computer Inc. (Taipei,
TW) |
| Appl. No.: | D/196,439 |
| Filed: | December 31, 2003 |
Foreign Application Priority Data
| Oct 15, 2003 [TW] | 92306268 | |||
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;165/80.3,121,122,146,104.33,180,185 ;174/16.3 ;257/706,707,718-722 ;361/271,274.3,695,697,700,702,704,709,710,711,514,719 |
References Cited [Referenced By]
U.S. Patent Documents
| 6137681 | October 2000 | Lu |
| 6412546 | July 2002 | Lin et al. |
| 6480387 | November 2002 | Lee et al. |
| 6560113 | May 2003 | Ma |
| 2003/0081382 | May 2003 | Lin |
| 2003/0117773 | June 2003 | Cheng et al. |
| 514485 | Dec 2002 | TW | |||
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Rabin & Berdo, P.C.
Description
FIG. 1 is a perspective view of a thermal module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear elevational view thereof.
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