High density interconnection device

Description

FIG. 1 is a rear perspective view illustrating a high density interconnection device in accordance with one embodiment of the invention.

FIG. 2 is a front perspective view of the high density interconnection device of FIG. 1.

FIG. 3 is a front elevation view of the high density interconnection device of FIG. 1.

FIG. 4 is a rear elevation view of the high density interconnection device of FIG. 1.

FIG. 5 is a first side elevation view of the high density interconnection device of FIG. 1.

FIG. 6 is a second side elevation view of the high density interconnection device of FIG. 1.

FIG. 7 is a top plan view of the high density interconnection device of FIG. 1.

FIG. 8 is a bottom plan view of the high density interconnection device of FIG. 1.

FIG. 9 is a rear perspective view illustrating a high density interconnection device in accordance with another embodiment of the invention.

FIG. 10 is a front perspective view of the high density interconnection device of FIG. 9.

FIG. 11 is a front elevation view of the high density interconnection device of FIG. 9.

FIG. 12. is a rear elevation view of the high density interconnection device of FIG. 9.

FIG. 13 is a first side elevation of the high density interconnection device of FIG. 9.

FIG. 14 is a second side elevation view of the high density interconnection device of FIG. 9.

FIG. 15 is a top plan view of the high density interconnection device of FIG. 9; and,

FIG. 16 is a bottom plan view of the high density interconnection device of FIG. 9.

The broken line portions of the disclosure are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design of a high density interconnection device, as shown and described.

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Inventors:	Dulai; Harjinder (Unionville, CA), Chen; Yen-Ming (Markham, CA), Szeto; Colin (North York, CA), Laurin; Edward J. (Etobicoke, CA), Daniels; Steven D. (Thornhill, CA), Drolet; Jean-Francois (Toronto, CA)
Assignee:	ATI Technologies Inc. (Ontario, CA)
Appl. No.:	D/152,841
Filed:	December 28, 2001

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Current U.S. Class:	D13/133
Current International Class:	1303
Field of Search:	;D13/133,147,146 ;439/578,579,660,610,638,639

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References Cited [Referenced By]

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U.S. Patent Documents

D363269	October 1995	Riley et al.
D390534	February 1998	Prucey
D417432	December 1999	Baker et al.
D424017	May 2000	Lin
D425483	May 2000	Bechtold et al.
D426192	June 2000	Rathbun et al.
D449579	October 2001	Goto
D456010	April 2002	Goto

Primary Examiner: Hyder; Philip S.
Attorney, Agent or Firm: Vedder, Price, Kaufman & Kammholz, P.C.