Housing for electronic device

Description

FIG. 1 is a side elevation of a housing for electronic device showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a side elevation of the side opposite that shown in FIG. 1;

FIG. 4 is an end elevation thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is an end elevation of the end opposite that shown in FIG. 4; and,

FIG. 7 is a perspective view thereof.

Claims

We claim the ornamental design for a housing for electronic device, as shown.

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Inventors:	Jung; Richard K. (Laguna Niguel, CA), Puckett; Joie L. (Long Beach, CA)
Assignee:	D-Link Systems, Inc. (Irvine, CA)
Appl. No.:	D/168,559
Filed:	October 2, 2002

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Current U.S. Class:	D14/240
Current International Class:	1403
Field of Search:	;D14/240,146,217,299,257,301,433,191 ;D13/184,199 ;333/109,110 ;379/347 ;439/413.02,717,74

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References Cited [Referenced By]

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U.S. Patent Documents

D291310	August 1987	Ogura
D348070	June 1994	Vallillee
D351841	October 1994	Blankenship et al.
D363722	October 1995	Aldridge et al.
D373125	August 1996	Khoo
D374673	October 1996	Beaumont et al.
D383466	September 1997	Burrell et al.
D413605	September 1999	Thomas
D470848	February 2003	Morooka

Other References

Website printout: www.linksys.com, 1 sheet Aug. 1, 2002. . Website printout: www.smc.com, 9 sheets Aug. 1, 2002. . Website printout: www.netgear.com, 4 sheets Aug. 1, 2002. . Website printout: www.dlink.com, 2 sheets Aug. 1, 2002..

Primary Examiner: Rademaker; Charles A.
Attorney, Agent or Firm: Law Office of Duncan Palmatier Palmatier; Duncan