U.S. patent number D480,638 [Application Number D/178,435] was granted by the patent office on 2003-10-14 for blister pack.
This patent grant is currently assigned to Koninklijke Philips Electronics N.V.. Invention is credited to Wai Chung David Lee.
United States Patent |
D480,638 |
Lee |
October 14, 2003 |
Blister pack
Claims
The ornamental design for a blister pack, as shown.
Inventors: |
Lee; Wai Chung David (Kowloon,
CN) |
Assignee: |
Koninklijke Philips Electronics
N.V. (Eindhoven, NL)
|
Appl.
No.: |
D/178,435 |
Filed: |
March 26, 2003 |
Foreign Application Priority Data
|
|
|
|
|
Oct 16, 2002 [WO] |
|
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DMA/005 855 |
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Current U.S.
Class: |
D9/415 |
Current International
Class: |
0903 |
Field of
Search: |
;D9/414,415,418,337,457
;206/461-471,806,495,769-776,761-765 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Bartlett; Ernestine C.
Description
FIG. 1 is a perspective view showing my design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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