Blister pack
Lee October 7, 2
U.S. patent number D480,300 [Application Number D/178,441] was granted by the patent office on 2003-10-07 for blister pack. This patent grant is currently assigned to Koninklijke Philips Electronics N.V.. Invention is credited to Wai Chung David Lee.
| United States Patent | D480,300 |
| Lee | October 7, 2003 |
Blister pack
Claims
The ornamental design for a blister pack, as shown.
| Inventors: | Lee; Wai Chung David (Hong Kong, CN) |
|---|---|
| Assignee: | Koninklijke Philips Electronics
N.V. (Eindhoven, NL) |
| Appl. No.: | D/178,441 |
| Filed: | March 26, 2003 |
Foreign Application Priority Data
| Oct 16, 2002 [WO] | DMA/005 855 | |||
| Current U.S. Class: | D9/415 |
| Current International Class: | 0903 |
| Field of Search: | ;D9/414,415,418,337,457 ;206/461-471,806,995,769-776,701-705 |
References Cited [Referenced By]
U.S. Patent Documents
| 5429241 | July 1995 | Althaus |
| D418407 | January 2000 | Uzawa |
| D431461 | October 2000 | Glassman |
| D433937 | November 2000 | Glassman |
| 6170663 | January 2001 | Glassman |
| D438103 | February 2001 | Edwards et al. |
| D442857 | May 2001 | Feeman |
| D458839 | June 2002 | Weinstein et al. |
| 6427832 | August 2002 | Ali et al. |
| D473787 | April 2003 | Jones, Jr. et al. |
Attorney, Agent or Firm: Bartlett; Ernestine C.
Description
FIG. 1 is a perspective view showing my design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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