U.S. patent number D475,682 [Application Number D/161,112] was granted by the patent office on 2003-06-10 for optical sub-assembly module.
This patent grant is currently assigned to RiteKom Photonics Corporation. Invention is credited to Ling-Ying Chiang, Ing-Jer Ho, Wen-Chih Hsieh, Tuan-Yu Hung, Chang-You Li.
United States Patent |
D475,682 |
Li , et al. |
June 10, 2003 |
Optical sub-assembly module
Claims
The ornamental design for an optical sub-assembly module, as shown
and described.
Inventors: |
Li; Chang-You (Chia-Yi,
TW), Ho; Ing-Jer (Hsin-Chu, TW), Chiang;
Ling-Ying (Hsin-Chu, TW), Hung; Tuan-Yu
(Hsin-Chu, TW), Hsieh; Wen-Chih (Hsin-Chu Hsien,
TW) |
Assignee: |
RiteKom Photonics Corporation
(Hsin-Chu Hsien, TW)
|
Appl.
No.: |
D/161,112 |
Filed: |
May 24, 2002 |
Foreign Application Priority Data
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Feb 8, 2002 [TW] |
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91300598 |
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Current U.S.
Class: |
D13/133 |
Current International
Class: |
1302 |
Field of
Search: |
;D13/133 ;361/395
;362/363 ;439/188,668,567,490,541.5,79,83,871 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Baynham; Holly
Attorney, Agent or Firm: Hsu; Winston
Description
FIG. 1 is a front elevational view of an optical sub-assembly
module showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a perspective view thereof.
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