Portion of semiconductor device
Sako , et al. April 15, 2
U.S. patent number D473,199 [Application Number D/161,325] was granted by the patent office on 2003-04-15 for portion of semiconductor device. This patent grant is currently assigned to Kabushiki Kaisha Toshiba. Invention is credited to Kazuyoshi Fukuda, Takahiro Ide, Masahiro Ootomo, Shigeki Sako.
| United States Patent | D473,199 |
| Sako , et al. | April 15, 2003 |
Portion of semiconductor device
Claims
The ornamental design for a portion of semiconductor device, as shown and described.
| Inventors: | Sako; Shigeki (Yokohama, JP), Ootomo; Masahiro (Kitakyushu, JP), Fukuda; Kazuyoshi (Kitakyushu, JP), Ide; Takahiro (Yokohama, JP) |
|---|---|
| Assignee: | Kabushiki Kaisha Toshiba
(Tokyo, JP) |
| Appl. No.: | D/161,325 |
| Filed: | May 29, 2002 |
Foreign Application Priority Data
| Nov 30, 2001 [JP] | 2001-035199 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;174/52.1,52.2,52.4,52.5 ;206/710,719 ;257/666,678,690,691-697,704,780 ;361/600,742,820 |
References Cited [Referenced By]
U.S. Patent Documents
| D259559 | June 1981 | Mochizuki et al. |
| 5105257 | April 1992 | Michii |
| 5309018 | May 1994 | Shibata |
| 5585670 | December 1996 | Isshiki et al. |
| 5925927 | July 1999 | Orcutt |
| D416872 | November 1999 | Burke |
| 6020625 | February 2000 | Qin et al. |
| 6093957 | July 2000 | Kwon |
| 6177718 | January 2001 | Kozono |
| 800572 | Nov 1990 | JP | |||
| 1079850 | Jul 2000 | JP | |||
Other References
|
Extract of Denpa Shimbun (newspaper) showing a PAM built-in microcomputer (MB91110). . Extract of Denpa Shimbun (newspaper) showing a CCD signal processor (VSP2101). . Extract of Denpa Shimbun (newspaper) showing a AV decoder system LSI (MN677521) for a DVD player. . Extract of Denpa Shimbun (newspaper) showing a Scan USB (NET 1031). . Toshiba Catalog of micro controller (TMP86CM25F).. |
Primary Examiner: Shooman; Ted
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Description
FIG. 1 is a front, bottom and right side perspective view of a portion of semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.
The broken line portions are shown for illustrative purpose only and form no part of the claimed design.
* * * * *
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 