U.S. patent number D473,168 [Application Number D/162,004] was granted by the patent office on 2003-04-15 for bumper. This patent grant is currently assigned to Isuzu Motors Limited. Invention is credited to Keishi Hayashi.
United States Patent | D473,168 |
Hayashi | April 15, 2003 |
Inventors: | Hayashi; Keishi (Kanagawa, JP) |
---|---|
Assignee: | Isuzu Motors Limited (Tokyo,
JP) |
Appl. No.: | D/162,004 |
Filed: | June 5, 2002 |
Current U.S. Class: | D12/169 |
Current International Class: | 1216 |
Field of Search: | ;D12/169,196,90-92 ;293/113,115,117,120 ;296/180.1,180.2 |
D372695 | August 1996 | Nagashima |
D436067 | January 2001 | Okano et al. |
D462640 | September 2002 | Sakae |
D463334 | September 2002 | Homan |
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