Hybrid integrated circuit board

Description

FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof, which is symmetrical to a rear elevational view not shown herein;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for a hybrid integrated circuit board, as shown and described.

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Inventors:	Ebihara; Hitoshi (Tokyo, JP), Tomaru; Naoki (Tokyo, JP), Wasada; Yoshiyuki (Tokyo, JP), Ito; Tetsuya (Tokyo, JP), Kato; Hideki (Tokyo, JP), Igarashi; Tomohiro (Tokyo, JP), Yoda; Hideki (Tokyo, JP)
Assignee:	Taiyo Yuden Co., Ltd. (Tokyo, JP)
Appl. No.:	D/158,467
Filed:	April 5, 2002

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	145536	Jul 26, 2001

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Foreign Application Priority Data

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Apr 27, 2001 [JP]			2001-016237

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/110,123,133,184,182,199 ;D10/46,75 ;29/829-832,846 ;174/250-251,253,254,260-261,268 ;216/13 ;292/314 ;316/718,748,752-753,760,783,820 ;411/500 ;428/901 ;470/27

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References Cited [Referenced By]

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U.S. Patent Documents

D357671	April 1995	Terasawa et al.
5742480	April 1998	Sawada et al.
D396450	July 1998	Nishiura et al.
5838546	November 1998	Miyoshi
5905639	May 1999	Warren
6028773	February 2000	Hundt
6201701	March 2001	Linden et al.

Primary Examiner: Shooman; Ted
Assistant Examiner: Bui; Daniel
Attorney, Agent or Firm: Bacon & Thomas