U.S. patent number D462,900 [Application Number D/144,829] was granted by the patent office on 2002-09-17 for package.
This patent grant is currently assigned to Kao Corporation. Invention is credited to Hirotoshi Tawara, Takashi Yamada.
United States Patent |
D462,900 |
Yamada , et al. |
September 17, 2002 |
Package
Claims
The ornamental design for a package, as shown and described.
Inventors: |
Yamada; Takashi (Tokyo,
JP), Tawara; Hirotoshi (Tokyo, JP) |
Assignee: |
Kao Corporation
(JP)
|
Appl.
No.: |
D/144,829 |
Filed: |
July 11, 2001 |
Foreign Application Priority Data
|
|
|
|
|
Jan 23, 2001 [JP] |
|
|
2001-001241 |
|
Current U.S.
Class: |
D9/707 |
Current International
Class: |
0903 |
Field of
Search: |
;D9/415,416,417,305,337,339,414
;206/.5,.6,.7,266,277,63.3,484,484.1,484.2,822,824
;229/123.1,201-207 ;222/541.2,541.3,541.4,107 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Saidman DesignLaw Group
Description
FIG. 1 is a front perspective view of a package showing our new
design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a rear view thereof;
FIG. 7 is a left side view thereof;
FIG. 8 is a right side view thereof;
FIG. 9 is a sectional view taken vertically at the central position
of the front view thereof; and,
FIG. 10 is a view of the article with its top cover being
peeled.
* * * * *