Mold produced housing for enclosing the connection between a cable and a connector

Milan July 10, 2

Patent Grant D444772

U.S. patent number D444,772 [Application Number D/132,526] was granted by the patent office on 2001-07-10 for mold produced housing for enclosing the connection between a cable and a connector. Invention is credited to Henry Milan.


United States Patent D444,772
Milan July 10, 2001

Mold produced housing for enclosing the connection between a cable and a connector

Claims

The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.
Inventors: Milan; Henry (Rochester Hills, MI)
Appl. No.: D/132,526
Filed: November 10, 2000

Current U.S. Class: D13/154; D13/146
Current International Class: 1303
Field of Search: ;D13/133,146,147,154,156 ;434/445,483,488-490,606-610,680

References Cited [Referenced By]

U.S. Patent Documents
D298931 December 1988 Sekiguchi
D320001 September 1991 Hirabayashi
D334173 March 1993 Liu et al.
D399189 October 1998 Lin
D411175 June 1999 Doren et al.
D412883 August 1999 Nakazawa
D413100 August 1999 Nakazawa
D425487 May 2000 Lee
4493525 January 1985 Hall et al.
4611878 September 1986 Hall et al.
4637669 January 1987 Tajima
4650270 March 1987 Tajima et al.
4741708 May 1988 Yoshida
4824402 April 1989 Sorimachi
5417585 May 1995 Morin et al.
Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Marshall & Melhorn, LLC

Description



FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design.

FIG. 2 is a rear elevational view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

The broken lines in FIG. 1 are included for the purpose of illustrating environmental structure only and form no part of the claimed design.

* * * * *


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