Mold produced housing for enclosing the connection between a cable and a connector

Milan June 12, 2

Patent Grant D443593

U.S. patent number D443,593 [Application Number D/132,483] was granted by the patent office on 2001-06-12 for mold produced housing for enclosing the connection between a cable and a connector. Invention is credited to Henry Milan.


United States Patent D443,593
Milan June 12, 2001

Mold produced housing for enclosing the connection between a cable and a connector

Claims

The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.
Inventors: Milan; Henry (Rochester Hills, MI)
Appl. No.: D/132,483
Filed: November 10, 2000

Current U.S. Class: D13/154; D13/147
Current International Class: 1303
Field of Search: ;D13/133,146,147,154,156 ;439/344,447,676

References Cited [Referenced By]

U.S. Patent Documents
D303656 September 1989 Wong et al.
D304028 October 1989 Matsuzaki
D358802 May 1995 Kunz
D379177 May 1997 Chu
D402266 December 1998 Siemon et al.
D412314 July 1999 Lee
D430541 September 2000 Lee et al.
D434380 November 2000 Watanabe
5334044 August 1994 Falossi et al.
5462457 October 1995 Schroepfer et al.
5493475 February 1996 Lin
5538438 July 1996 Orlando
5600885 February 1997 Schroepfer et al.
5620335 April 1997 Siemon
5685731 November 1997 Lin
5685736 November 1997 Lung
6080001 June 2000 Wong
Primary Examiner: Sincavage; Joel
Attorney, Agent or Firm: Marshall & Melhorn, LLC

Description



FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

The broken lines in FIG. 1 are included for the purpose of illustrating environmental structure only and form no part of the claimed design.

* * * * *


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