U.S. patent number D399,206 [Application Number D/075,537] was granted by the patent office on 1998-10-06 for headphone.
This patent grant is currently assigned to Sony Corporation. Invention is credited to Mitsuhiro Nakamura, Hiroshi Yasutomi.
United States Patent |
D399,206 |
Yasutomi , et al. |
October 6, 1998 |
Headphone
Claims
The ornamental design for a headphone, as shown and described.
Inventors: |
Yasutomi; Hiroshi (Tokyo,
JP), Nakamura; Mitsuhiro (Tokyo, JP) |
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/075,537 |
Filed: |
September 2, 1997 |
Foreign Application Priority Data
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|
|
|
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May 29, 1997 [JP] |
|
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9-55852 |
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Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/192,205-206,223,299
;181/129 ;379/430,444 ;381/25,68,158,183,187 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Morris; Sandra L.
Assistant Examiner: Bondade; Nanda
Attorney, Agent or Firm: Foley & Lardner
Description
FIG. 1 is a perspective view of a first embodiment of a headphone
showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a left side elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of a headphone
showing our new design;
FIG. 9 is a top plan view of the embodiment of FIG. 8;
FIG. 10 is a front elevational view of the embodiment of FIG.
8;
FIG. 11 is a right side elevational view of the embodiment of FIG.
8;
FIG. 12 is a bottom plan view of the embodiment of FIG. 8;
FIG. 13 is a rear elevational view of the embodiment of FIG. 8;
FIG. 14 is a left side elevational view of the embodiment of FIG.
8; and,
FIG. 15 is a reference perspective view wherein the embodiment of
FIG. 8 is in the using condition. The person and cord portions in
broken lines are for illustrative purposes only and form no part of
claimed design.
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