Headphone

Description

FIG. 1 is a perspective view of a first embodiment of a headphone showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a bottom plan elevational view thereof;

FIG. 7 is a rear elevational view thereof;

FIG. 8 is a top plan view thereof wherein the covers are in the open position;

FIG 9 is a front elevational view thereof wherein the covers are in the open position;

FIG. 10 is a perspective view of a second embodiment of a headphone showing my new design;

FIG. 11 is a top plan view of the embodiment of FIG. 10;

FIG. 12 is a front elevational view of the embodiment of FIG. 10;

FIG. 13 is a right side elevational view of the embodiment of FIG. 10;

FIG. 14 is a left side elevational view of the embodiment of FIG. 10;

FIG. 15 is a bottom plan view of the embodiment of FIG. 10;

FIG. 16 is a rear elevational view of the embodiment of FIG. 10;

FIG. 17 is a top plan view of the embodiment of FIG. 10 wherein the covers are in the open position; and,

FIG. 18 is a front elevational view of the embodiment of FIG. 10 wherein the covers are in the open position.

Claims

The ornamental design for a headphone, as shown and described.

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Inventors:	Nakamura; Mitsuhiro (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/059,291
Filed:	September 6, 1996

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Current U.S. Class:	D14/205
Current International Class:	1401
Field of Search:	;D14/188,189,192,206,223 ;181/129,130 ;379/430,431,444 ;381/25,68,158,183,187

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References Cited [Referenced By]

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U.S. Patent Documents

D254183	February 1980	Doodson
D255352	June 1980	Besasie
D353818	December 1994	Nakamura
D369604	May 1996	Morimiya

Primary Examiner: Shooman; Ted
Assistant Examiner: Bondade; Nanda
Attorney, Agent or Firm: Foley & Lardner