U.S. patent number D388,504 [Application Number D/050,179] was granted by the patent office on 1997-12-30 for electromagnetic valve.
This patent grant is currently assigned to SMC Corporation. Invention is credited to Bunya Hayashi, Makoto Ishikawa, Shinji Miyazoe.
United States Patent |
D388,504 |
Hayashi , et al. |
December 30, 1997 |
Electromagnetic valve
Claims
The ornamental design for an electromagnetic valve, as shown and
described.
Inventors: |
Hayashi; Bunya (Yawara-mura,
JP), Miyazoe; Shinji (Yawara-mura, JP),
Ishikawa; Makoto (Yawara-mura, JP) |
Assignee: |
SMC Corporation (Tokyo,
JP)
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Appl.
No.: |
D/050,179 |
Filed: |
February 9, 1996 |
Foreign Application Priority Data
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Aug 11, 1995 [JP] |
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7-23576 |
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Current U.S.
Class: |
D23/233 |
Current International
Class: |
2301 |
Field of
Search: |
;D23/233,248,247
;137/884,269 ;251/625.64,625.69 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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203780 |
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Aug 1989 |
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JP |
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6300158 |
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Oct 1994 |
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JP |
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Primary Examiner: Shooman; Ted
Assistant Examiner: Tuttle; C.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier
& Neudstadt, P.C.
Description
FIG. 1 is a top, front, and left side perspective view of an
electromagnetic valve, showing our new design;
FIG. 2 is a top, rear and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a top, rear and left side view of a second embodiment of
our design, the undisclosed sides being identical to the first
disclosed embodiment except for the upward orientation of the lead
wire connector;
FIG. 9 is a top plan view thereof; and,
FIG. 10 is a right side view thereof.
The undisclosed bottom surface forms no part of the claimed
design.
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