IC module
Ishihara December 23, 1
U.S. patent number D388,066 [Application Number D/062,837] was granted by the patent office on 1997-12-23 for ic module. This patent grant is currently assigned to Kabushiki Kaisha Toshiba. Invention is credited to Tomiaki Ishihara.
| United States Patent | D388,066 |
| Ishihara | December 23, 1997 |
IC module
Claims
The ornamental design for an IC module, as shown and described.
| Inventors: | Ishihara; Tomiaki (Yokohama, JP) |
|---|---|
| Assignee: | Kabushiki Kaisha Toshiba
(Kawasaki, JP) |
| Appl. No.: | D/062,837 |
| Filed: | November 27, 1996 |
Foreign Application Priority Data
| May 29, 1996 [JP] | 8-15401 | |||
| Current U.S. Class: | D14/437 |
| Current International Class: | 1402 |
| Field of Search: | ;D14/114,117,107 ;235/378-380,492,487 ;257/731,669 |
References Cited [Referenced By]
U.S. Patent Documents
| D357909 | May 1995 | Gloton |
| D368903 | April 1996 | Ohmori et al. |
| D369156 | April 1996 | Ohmori et al. |
| D369157 | April 1996 | Ohmori et al. |
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Description
FIG. 1 is a front, bottom and right side perspective view of an IC module showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof, the opposite side being a mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear elevational view thereof.
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