External modem enclosure for a data processing system

Hill , et al. September 2, 1

Patent Grant D383139

U.S. patent number D383,139 [Application Number D/046,045] was granted by the patent office on 1997-09-02 for external modem enclosure for a data processing system. This patent grant is currently assigned to International Business Machines Corporation. Invention is credited to David Wayne Hill, Tim Kerry Murphy.


United States Patent D383,139
Hill ,   et al. September 2, 1997

External modem enclosure for a data processing system

Claims

The ornamental design for an external modem enclosure for a data processing system, as shown and described.
Inventors: Hill; David Wayne (Cary, NC), Murphy; Tim Kerry (Rochester, MN)
Assignee: International Business Machines Corporation (Armonk, NY)
Appl. No.: D/046,045
Filed: November 6, 1995

Current U.S. Class: D14/242
Current International Class: 1403
Field of Search: ;D14/100,107,114,109,240,242,256,140,142,241 ;D13/162,164,184 ;379/441,442 ;174/52.1,50,67 ;361/641,658,673,679,724,728,730,825 ;455/89,90,349

References Cited [Referenced By]

U.S. Patent Documents
D174406 April 1955 Adler
D252753 August 1979 Thompson et al.
D295178 April 1988 Pedinielli et al.
D302268 July 1989 Larson et al.
D303252 September 1989 Shih
D309731 August 1990 Takai
D346606 May 1994 Harris et al.
D346607 May 1994 Bhargava et al.
D353598 December 1994 Brandt et al.
D357235 April 1995 Takahashi
3896384 July 1975 Henderson
Primary Examiner: Asch; Jeffrey
Attorney, Agent or Firm: Bussan; Matthew J.

Description



FIG. 1 is a top, front, right side isometric view of an external modem enclosure for a data processing system, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof, the left side being identical;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a top, front, right side isometric view of an external modem enclosure for a data processing system, showing a second embodiment of our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a right side elevational view thereof, the left side being identical;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a top, front, right side isometric view of an external modem enclosure for a data processing system, showing a third embodiment our new design;

FIG. 14 is a front elevational view thereof;

FIG. 15 is a right side elevational view thereof, the left side being identical;

FIG. 16 is a top plan view thereof;

FIG. 17 is a bottom plan view thereof; and,

FIG. 18 is a rear elevational view thereof.

The three embodiments are identical in all respects except for the left portion of the front panel and the electrical connections on the rear panel.

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