Base board for a package
Morita July 9, 1
U.S. patent number D371,512 [Application Number D/026,389] was granted by the patent office on 1996-07-09 for base board for a package. This patent grant is currently assigned to Aiwa Co., Ltd.. Invention is credited to Takashi Morita.
| United States Patent | D371,512 |
| Morita | July 9, 1996 |
Base board for a package
Claims
The ornamental design for a base board for a package, as shown and described.
| Inventors: | Morita; Takashi (Tokyo, JP) |
|---|---|
| Assignee: | Aiwa Co., Ltd. (Tokyo,
JP) |
| Appl. No.: | D/026,389 |
| Filed: | July 25, 1994 |
| Current U.S. Class: | D9/415 |
| Field of Search: | ;D9/415,418,433,457 ;206/461-471,806,495 |
References Cited [Referenced By]
U.S. Patent Documents
| 2967611 | January 1961 | Bolineer |
| 3275274 | September 1966 | Hutcheon |
| 3685648 | August 1972 | Heller |
| 3799357 | March 1974 | Govang |
| 4549658 | October 1985 | Sfikas |
| 4650074 | March 1987 | Vosbikian |
| 4986421 | January 1991 | Lipsitz |
Other References
|
Hardware Age, Mar. 1989, p. 253. . Modern Packaging, 1972-1973, p. 104.. |
Primary Examiner: Deshmukh; Prabhakar G.
Attorney, Agent or Firm: Cushman Darby & Cushman
Description
FIG. 1 is a perspective view of a base board for a package from the front, right side and bottom;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof, the left side being identical thereto; and,
FIG. 5 is a top plan view thereof, the bottom being identical thereto.
The stippling which appears in FIGS. 1 and 2 depicts a graphical pattern on the front surface of the article.
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