Package for a wafer for the welding and/or cutting of plastic tubes

Description

FIG. 1 is a front elevational view of a package for a wafer for the welding and/or cutting of plastic tubes in accordance with this invention shown in the enclosed condition;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof with the right side being a mirror image;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a front elevational view of the package in an opened condition;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a perspective view thereof.

Claims

The ornamental design for a package for a wafer for the welding and/or cutting of plastic tubes, as shown and described.

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Inventors:	Ivansons; Ivars V. (Newark, DE), Ivansons; Valdis (Wilmington, DE), Spencer; Dudley W. C. (Wilmington, DE)
Assignee:	Denco, Inc. (Wilmington, DE)
Appl. No.:	D/017,601
Filed:	January 18, 1994

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Current U.S. Class:	D9/415
Field of Search:	;D9/415,346,433,432,456,457 ;206/45.33,45.13,491,492,495,472,90,92,93,105,118,119 ;229/40,87.01

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References Cited [Referenced By]

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U.S. Patent Documents

D339063	September 1993	Simon
2351223	June 1944	Neivert
3373866	March 1968	Will
4015708	April 1977	Kelm
4016973	April 1977	Blake
4333565	June 1982	Woods
4570797	February 1986	Weinman
5085318	February 1992	Leverick

Other References

Modern Packaging, 1958, p. 340, as circled. . Packaging, 1959, p. 59, as circled..

Primary Examiner: Deshmukh; Prabhakar G.
Attorney, Agent or Firm: Connolly & Hutz