U.S. patent number D331,011 [Application Number 07/529,166] was granted by the patent office on 1992-11-17 for blister package.
This patent grant is currently assigned to Canon Kabushiki Kaisha. Invention is credited to Seiichiro Karita, Akio Saito.
United States Patent |
D331,011 |
Karita , et al. |
* November 17, 1992 |
Blister package
Claims
The ornamental design for a blister package, as shown and
described.
Inventors: |
Karita; Seiichiro (Yokohama,
JP), Saito; Akio (Hadano, JP) |
Assignee: |
Canon Kabushiki Kaisha (Tokyo,
JP)
|
[*] Notice: |
The portion of the term of this patent
subsequent to November 17, 2006 has been disclaimed. |
Appl.
No.: |
07/529,166 |
Filed: |
May 25, 1990 |
Foreign Application Priority Data
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Nov 28, 1989 [JP] |
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1-43469 |
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Current U.S.
Class: |
D9/415;
D9/425 |
Field of
Search: |
;D9/415,418,424,425,341,346,347 ;206/461-471,328,822,806 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Ansher; Bernard
Assistant Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Fitzpatrick, Cella, Harper &
Scinto
Description
FIG. 1 is a front elevational view of a blister package showing our
new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a perspective view thereof.
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