Heat insulating cylinder for thermal treatment of semiconductor wafers

Description

FIG. 1 is a front elevational view of a heat insulating cylinder for thermal treatment of semiconductor wafers showing our new design;

FIG. 2 is a right side elevational view, the left side elevational view being a mirror image;

FIG. 3 is a top plan view;

FIG. 4 is a bottom plan view; and,

FIG. 5 is a rear elevational view thereof.

Claims

The ornamental design for a heat insulating cylinder for thermal treatment of semiconductor wafers, as shown and described.

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Inventors:	Nakao; Ken (Sagamihara, JP), Sato; Seishiro (Machida, JP), Ohkase; Wataru (Sagamihara, JP)
Assignee:	Tel Sagami Limited (Kanagawa, JP)
[*] Notice:	The portion of the term of this patent subsequent to May 19, 2006 has been disclaimed.
Appl. No.:	07/301,997
Filed:	January 25, 1989

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Foreign Application Priority Data

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Jul 25, 1988 [JP]			63-29832

Current U.S. Class:	D15/144.1
Field of Search:	;D15/144.1 ;219/390,411 ;432/6,33,239,241,253,258,260,261

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References Cited [Referenced By]

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U.S. Patent Documents

D215093	September 1969	Cone
D234847	April 1975	Hoffman
D258526	March 1981	Nederman
3604694	September 1971	Muller
3737282	June 1973	Hearn et al.
3744650	July 1973	Henebry et al.
4761134	August 1988	Foster
4849608	July 1989	Muraoka et al.

Foreign Patent Documents

	17213		1888		GB

Primary Examiner: Walsh; Donald P.
Assistant Examiner: Davis; Antoine D.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt